Feature Highlights:

Chinese Zodiac Edition: Limited edition “Year of the Dragon” design.

One-key Overclock: An easy-to-use overclocking button located at the rear I/O activates the overclocking function for a quick and easy performance boost without opening software.

Efficient Air Concentration: With triple fans to enhance air pressure and air input, supporting auto-stop technology.

Customizable RGB Lighting: Featuring customizable RGB lighting via the iGame Center app.

Year of the Dragon Accessories: With a set of accessories including a gold Dragon Coin, Chinese red lucky envelopes, and a Loong Edition gaming mousepad.

Feature Highlights:

ULTRA Retro RGB: Eye-catching and visualizing with the combination of the holographic shroud design and RGB lighting.

Battle Ax Backplate: Improved backplate design that provides structural rigidity and passive heat dissipation.

Hollow Back Panel: A hollow back panel design that allows airflow to freely pass through the heatsink. This design greatly improves heat dissipation compared to conventional GPU air cooling designs.

Efficient Airflow: With triple fans to improve air pressure and inlet volume, supporting auto-stop technology.

Reflow Soldering Technique: The process ensures that the thermal tube and the fin fit perfectly, optimizing heat dissipation performance and achieving excellent heat dissipation effects.

· Cyberpunk Style Metal Armor Design
· One-Key Overclock
· Magnetic Split iGame Smart LCD Screen
· Vulcan Angle Adjustment Display Dock
· Vulcan Lightblade RGB on the Side, Rear, and Backplate
· Bundled with Metal Support Stand

Feature Highlights:

· Red and Black Color Contrast Design
· Metallic Hollowed Backboard
· Axe Cooling System with Ring-Shaped Fans
· RGB Lighting Effect on the Side

Feature Highlights:

· White and Pink Color Scheme
· Hip-Hop Style Hollowed Backboard
· One-Key Overclock
· Large Horizontal RGB Lighting Effects
· Ultra Cooling System with Ring-Shaped Fans
· “iGame ULTRA” Decorative Pattern

Feature Highlights:

Battle Ax Backplate: Improved backplate design that provides structural rigidity and passive heat dissipation.

Hollow Back Panel: A hollow back panel design that allows airflow to freely pass through the heatsink. This design greatly improves heat dissipation compared to conventional GPU air cooling designs.

Efficient Airflow: With triple fans to improve air pressure and inlet volume, supporting auto-stop technology.

Reflow Soldering Technique: The process ensures that the thermal tube and the fin fit perfectly, optimizing heat dissipation performance and achieving excellent heat dissipation effects.