Feature Highlights:

ULTRA Retro RGB: Eye-catching and visualizing with the combination of the holographic shroud design and RGB lighting.

ULTRA Cooling: A triple-fan cooler design with a high-performance heatsink for fast heat dissipation.

One-Key Overclock: A conveniently placed button located at the rear I/O that activates the overclocking function for a quick and easy performance boost without opening software.

Hollow Back Panel: A hollow back panel design that allows airflow to freely pass through the heatsink. This design greatly improves heat dissipation compared to conventional GPU air cooling designs.

Customizable RGB Lighting: RGB lit ULTRA design is fully customizable using the iGame Center software.

Feature Highlights:

· White and Pink Color Scheme
· Hip-Hop Style Hollowed Backboard
· One-Key Overclock
· Large Horizontal RGB Lighting Effects
· Ultra Cooling System with Ring-Shaped Fans
· “iGame ULTRA” Decorative Pattern

Feature Highlights:

· White and Pink Color Scheme
· Hip-Hop Style Hollowed Backboard
· One-Key Overclock
· Large Horizontal RGB Lighting Effects
· Ultra Cooling System with Ring-Shaped Fans
· “iGame ULTRA” Decorative Pattern

Feature Highlights:

ULTRA Retro RGB: Eye-catching and visualizing with the combination of the holographic shroud design and RGB lighting.

ULTRA Cooling: A triple-fan cooler design with a high-performance heatsink for fast heat dissipation.

One-Key Overclock: A conveniently placed button located at the rear I/O that activates the overclocking function for a quick and easy performance boost without opening software.

Hollow Back Panel: A hollow back panel design that allows airflow to freely pass through the heatsink. This design greatly improves heat dissipation compared to conventional GPU air cooling designs.

Customizable RGB Lighting: RGB lit ULTRA design is fully customizable using the iGame Center software.

Feature Highlights:

ULTRA Retro RGB: Eye-catching and visualizing with the combination of the holographic shroud design and RGB lighting.

Battle Ax Backplate: Improved backplate design that provides structural rigidity and passive heat dissipation.

Hollow Back Panel: A hollow back panel design that allows airflow to freely pass through the heatsink. This design greatly improves heat dissipation compared to conventional GPU air cooling designs.

Efficient Airflow: With triple fans to improve air pressure and inlet volume, supporting auto-stop technology.

Reflow Soldering Technique: The process ensures that the thermal tube and the fin fit perfectly, optimizing heat dissipation performance and achieving excellent heat dissipation effects.